SMT CAPABILITIES
SMT Manufacturing Capabilities
Company-provided SMT parameters for board handling, solder paste printing, SPI, placement, AOI and 3D X-ray. Confirm the assembly requirements and acceptance criteria for your project.
OBEST / COMPANY-PROVIDED DATA
SMT Manufacturing Capabilities
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| Process | Parameter | Capability |
|---|---|---|
| Board Handling | Board size | 50 × 50 mm to 500 × 500 mm |
| Board thickness | 0.2–4 mm | |
| Solder Paste Printing | Printing support | Magnetic fixture / vacuum platform |
| Clamping | Vacuum holding, two-sided clamping, flexible clamping for thin and thick boards | |
| Stencil cleaning | Dry / wet / vacuum | |
| Printing accuracy | ±0.025 mm | |
| SPI | Volume repeatability | <1% at 3σ |
| Component Placement | Component specification | 0603 (option); connector length 75 mm |
| Placement pitch | 0.15 mm | |
| Placement repeatability | ±0.01 mm | |
| AOI | Field of view | 61 × 45 mm |
| Inspection speed | 9150 mm²/s | |
| 3D X-ray | Imaging angle | 0–45° |
Capabilities depend on the material, stack-up and process combination. Final feasibility is confirmed after engineering review.
The unit convention for “0603 (option)” is unspecified. This entry is not a minimum package-size claim.
Individual limits must be reviewed in combination. These figures do not imply that every maximum or minimum can be achieved simultaneously. Other assembly processes, test coverage and delivery arrangements require project-specific confirmation.
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